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LMQ61460-Q1: VQFP-HR Housing cooling

Stephan Schade
Prodigy 150 points
Part Number: LMQ61460-Q1 
Hello community
What is the best way to cool the LMQ61460 (VQFP-HR housing). 
The component does not have a dedicated thermal pad. I intend to use a heat sink, 
where does it mainly have to start? on top of the component, on the board itself, or both?
  • 0
    TI__Expert 3650 points

    Hi Stephan,

    For LMQ61460-Q1, we don't really recommend the external heat sink for cooling. Typically the thermal is dissipated via the pins and the connected copper.

    It is highly recommended that you strictly follow the layout guides in the datasheet: Provide enough PCB area for proper heat sinking: Enough copper area must be used to ensure a low RθJA, commensurate with the maximum load current and ambient temperature. Make the top and bottom PCB layers with two-ounce copper and no less than one ounce.

    Also, we recommend the PCB design be multiple copper layers (for example, 4 layer in our EVM board), on which thermal vias can also be connected to the inner layer heat-spreading ground planes. Note that the package of this device dissipates heat through all pins. Wide traces must be used for all pins except where noise considerations dictate minimization of area.

    Adding the heat sink will help, but will also bring some design challenges. If you do so, please make sure the close contact between the heat sink and the device to ensure a low RθJA, while making sure that the heat sink will not add too much stress on the device itself.

    Regards,

    Xiaoying