REF3112: Difference between Q1 and Non-Q1

Hi Sato-san,

Here is some literature explaining some of the differences between Q1 and non-Q1:

12 QUALIFICATION / RELIABILITY:

Quality and reliability are built into TI’s culture, with the goal of providing customers high quality Products. TI’s semiconductor technologies are developed with a minimum goal of fewer than 50 Failures in Time (FIT) at 100,000 Power-On-Hours at 105⁰C junction temperature. TI builds simulations, accelerated testing, and robustness evaluations into the Product development process. During the Product development process, TI carefully assesses silicon process reliability, package reliability, and silicon/package interaction. TI also evaluates manufacturability of the Product to verify a robust silicon and assembly flow to enable continuity of supply to customers. Non-Automotive Products are qualified with industry standard test methodologies performed to the intent of Joint Electron Devices Engineering Council (JEDEC). Other standards (e.g. IPC/MIL/ANSI) may be used when appropriate. Automotive Products are qualified to meet the Automotive Electronics Council (AEC)-Q100 standards. Qualification test results for Automotive and HiRel Defense and Aerospace Products are made available to customers upon request.

13 PROCESS MONITORING / PRODUCT ASSURANCE

TI uses process measurement and monitoring for manufacturing process control and to minimize process and Product variation with a goal to achieve zero defects. Important characteristics are identified, data is analyzed, and statistical process control (SPC) is used in all phases of manufacturing with an emphasis on defect prevention versus detection. Automated systems are applied for Product statistical yield outlier (SYL) and standard statistical bin outlier (SBL) with quarterly limit recalculation, where applicable. Additional statistical based controls may be available for specific design and process technology that is based on business product engineering. TI manufacturing uses process capability measurements as a key component of process monitoring and control with a goal to achieve values of Cp > 2.00 and Cpk > 1.67. For critical charts on Automotive Products, characteristics with Cpk between 1.67 and 1.33, continuous improvement activities will be documented to ensure process improvement and Cpk values remain above 1.33. For Automotive Products any characteristics with a CpK < 1.33 will have an identified action plan to improve the process capability and an identified containment plan to screen out product not meeting specifications. Measurement systems used for process monitoring are controlled by using established qualification, verification and calibration procedures. TI manufacturing personnel are trained to use and employ statistical control processes and procedures as an additional component of process monitor and control. A test of outgoing Product is included as part of process and product monitoring. This monitoring may include inline parametric, functional, visual verification utilizing statistical and product outlier control methods. Samples (such as “golden” samples) may also be used as references for the manufacturing process and final Product.

15 PRODUCTION PART APPROVAL PROCESS (PPAP)

Upon request, TI supplies PPAP documents for Automotive Products, which are designed in to a customer’s applications per the Automotive Industry Action Group (AIAG) Manual.

Ben