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TPS40200-HT: Thermal and power dissipation Inquiry

Jonathan Navor
Expert 7805 points
Part Number: TPS40200-HT
Other Parts Discussed in Thread: TPS62110-HT, LP2989

Hi Guys,

Good day! 

Our customer have two technical questions about two integrated circuits: TPS40200-HT and the TPS62110-HT

1) What is the approximate junction-to-ambient thermal resistance of the TPS40200-HT? I didn’t find any info about it on its datasheet.
2) Could you perhaps give us some information of the approximate size of the copper plane needed for heat sinking for the TPS62110-HT? Considering an application in which we would have a power dissipation of approx. 0.2W.

I hope you could help us provide this information. Thank you.

Best regards,

Jonathan

  • +1
    TI__Mastermind 49317 points

    Hi Jonathan,

    Q1: The TPS40200-HT is in an SOIC-8 package without a DAP, We can estimate the Rth-ja from similar products with this package (e.g. LP2989). A good starting point is 120degC/W.

    Q2: The TPS62110-HT has a DAP, so you can use some thermal vias to connect to the inner layer GND planes of the PCB. On the top layer where the IC is placed, just extend the GND plane from the DAP at both ends of the IC by 10-20mm. This also depends on max ambient temperature, airflow, and how many internal PCB layers are available for heatsinking.

    Regards,

    Tim