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TPS7B4253-Q1: TPS7B4253QDDARQ1 - Quality questions

hannah shon
Prodigy 130 points
Part Number: TPS7B4253-Q1

Hello Team,

I'm having design activity with my customer and their OEM requested below information. Could you check for each of items? Full PN is TPS7B4253QDDARQ1.

1. Encapsulation / Housing Material

 - Encapsulation/Housing material information is requrested because it the major contributor for the thermal expansion properties of the part.  In addition Encapsulation/Housing material can be affected by High Temperatures and humidity.

2. CTE

- This is the overall CTE (coefficient of thermal expansion) of the part that will induce stresses on the solder joint.  This information is needed in order to determine if testing for thermal fatigue is needed.

3. Soldering profile part rating

4. Max power rating

Thank you.

  • 0
    TI__Mastermind 38075 points

    Hi Hannah,

    1) Are you referring to the finish and/or base metal?

    2) I am reaching out to someone that may be able to provide this.

    3) Document SNOA292J has some information on solder profiles but we do not have a recommendation for the DDA package.

    4) This can be variable as it depends on the PCB layout, PCB thermal conditions (i.e. temperature of the board due to other components etc.) and ambient conditions. Though it is known to not be totally accurate, we can use R_thetaJA to make this calculation for a rough estimate. The junction temperature is calculated as follows:

    T_J = T_A + P_d * R_thetaJA

    P_d = (T_J - T_A) / R_thetaJA

    At room temperature this gives the max power dissipation as 2.75W and at 125C the max power dissipation is 0.55W.

    See this app note which discusses ways to estimate the junction temperature.

    Regards,

    Nick

  • 0 in reply to Nick Butts
    TI__Mastermind 38075 points

    Hi Hannah,

     

    Is the customer looking for a CTE from a Finite Element Model or a Mold Compound CTE?

    Thanks,

    Nick

  • 0 in reply to Nick Butts
    TI__Prodigy 130 points

    Hello Nick, Thanks for your comments and please refer to below for your questions.

    1) It's corresponding to mold compound type

    2) For CTE, they're asking for mold compound. They've checked PPAP and find out mold compund CTE 

    Sorry to push you but could I get your feedback ASAP? Customer need to report this in tomorrow's meeting so they're asking me urgently.

    Thank you.

  • +1 in reply to hannah shon
    TI__Mastermind 38075 points

    Hi Hannah,

    The Mold Compound material is EME-G700LB. I found this document that may have the information you need:

    http://www.mirrorsemi.com/pdf/G700L.pdf

    If it does not, you may need to contact Sumitomo Bakelite Co. Ltd. for more information.

    Regards,

    Nick