TPS62130A-Q1: Thermal Metrics

Jacob Wyrick

Part Number: TPS62130A-Q1

Hi team,

The Junction-to-Ambient thermal resistance spec in the TPS62130A-Q1 is smaller than the Junction-to-Case thermal resistance. Shown below.

This seems counterintuitive. Is this accurate? Is there any chance the values are flipped?

Thanks,

Jacob

over 2 years ago

+1 Amod Vaze over 2 years ago

TI__Mastermind 21755 points

Jacob,

Here is what I have found out from the thermal modeling team: The two tests are unrelated. Theta-JA assumes a natural convection environment with a 4 layer PCB, so most of the heat is dissipated through the exposed pad and into the board. Theta-JC (Top) assumes a 1 layer PCB with an infinite heat sink on top of the package designed to force all of the heat to the top of the package.

Thanks,
Amod

0 Jacob Wyrick over 2 years ago in reply to Amod Vaze

TI__Expert 5625 points

Thanks Amod! It makes sense that, since the testing set ups and assumptions are different, it can yield results like shown.

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TPS62130A-Q1: Thermal Metrics