CSD95372BQ5MC: X-ray analysis reveals consistent internal structure

Hi Kevin,

I am not sure if I understand your question. Wat do you think it's abnormal and what is a "yellow rank"? If possible, could you please mark the area you think might have issue?

Dear Mr Tang

thank you for you reply, pls check the pictrue, the xray scanning shows air bubble inside the chips, the testing orgnizision said:

X-ray analysis reveals consistent internal structure. Samples exhibit voids inside the component.

and they said it will be risky to use this part to high frequncy equipment. 

is this part is defective product because it has air bubble inside?

my customer is worried about the quality. pls advise.

Best regards

Kevin

Hi Kevin,

The voids in the Xray picture are most likely to be die attach voids, which is very common for semiconductor devices. And the voids you showed are actually for two FET die (HS FET and LS FET) adding together, so it seems to be OK for me. 

I am also checking with our packaging expert to get his comments. I will let you know once I have update.

thank you Mr Tang, i will waitting for your update.

I am still waiting for comments from packaging expect, will update once I have.

Dear Mr Tang

thank you, when i can get the reply from packaging? pls advise.

Hi Kevin,

Our expert is looking at your question, and we may still need few more days. I will update when I get response.

thank you Mr Tang, i will wait for it.

thank you Mr Tang for your work