Hi, I need the following thermal parameters for TPS7H2201-SP
- Thermal Conductivity Coefficient (W/m.K)
- Heat Capacity (J/kg.K)
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I will reach out to our thermal modeling team and update you here once I hear back from them.
Typically we report the following thermal metrics. Would these be sufficient for your needs?
|RθJA||Junction-to-ambient thermal resistance||°C/W|
|RθJC(top)||Junction-to-case (top) thermal resistance||°C/W|
|RθJC(bot)||Junction-to-case (bottom) thermal resistance||°C/W|
|RθJB||Junction-to-board thermal resistance||°C/W|
|ψJT||Junction-to-top characterization parameter||°C/W|
|ψJB||Junction-to-board characterization parameter||°C/W|
More information and definitions on the thermal metrics above can be found here if needed.