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PTH08T241W: package information confirm

Lidong Yu
Intellectual 1756 points
Part Number: PTH08T241W

I need some information in regards to the 2 pcs of pads connecting the component to the solder. Which, according to your product datasheet (attachment above), seems to be tin & copper plate?

1. How it is attached to the daughter PCB (the nickel plate blue color?)
2. What is the material of the plate? (cus we are not quite sure if that is nickel)
3. What does the plates function for? The one I point with arrow. There are 2 plates attaching the solder balls to your component
4. What are the acceptance criteria or recommended assembly method for this type of package. If we were to follow IPC, can we assume the part to be a BGA?

  • 0
    TI__Mastermind 18370 points

    Hi Lindong,

    We are trying to obtain the requested information for you.
    But this requires some additional time.
    I will get back to you by Wednesday September 29th or earlier.

    Regards,

    Yitzhak Bolurian

  • 0
    TI__Expert 8130 points

    Hello Lidong,

    1. What is the device (part number) on the bottom-right-image? It would be beneficial to know so we can take a look at the ePOD drawing which specifies material on bottom-right-corner of ePOD.
    2. Need info from #1 above
    3. The blue is like a washer to maintain a stand-off height at a consistent level.
    4. See attached file. It is an App Note for High Temperature Soldering Requirements for Plug-In-Products (PIP). I would
      recommend the following.

    Thanks,
    Alejandro

    0143.slta054a.pdf

  • 0 in reply to iAlejandro
    TI__Intellectual 1756 points

    Soldering Pad function for TI (Texas Instrument).pptx

    Has add addition information about this query, please check.

  • 0 in reply to Lidong Yu
    TI__Expert 8130 points

    HI Lidong,

    1. Materials are the same according to the ePOD for both devices. They are different products so the Packaging Team designed it differently.
    2. It's not attached to the daughter PCB. The washer maintains minimum bottom-side clearance. It also acts as insulator to maintain the solder in its intended location. See picture below.
    3. The blue plate is FR-4 Glass Epoxy.
    4. For the PTH05050WAZ, the gap provided in the image is not acceptable. Notice that at Time-0 the device has no gap. See image below.

    Regards,
    Alejandro

  • 0 in reply to iAlejandro
    TI__Intellectual 1756 points

    1. Understand that the blue washer is a glass epoxy that serves as an insulator and to maintain clearance. Also note that there is some gap between the blue washer to the daughter board. However, it appears that there are 2 plates (see photo), one silver plate which is slightly smaller in diameter attaching to the daughter PCB. May I know what is that? Is that a part of the component pin?

    2. Also note that the gap for the first type of solder joint on the left shall be deemed defective. How about the second type? See image attached. There is supposed to be a gap but not a gap this wide maybe? Is it still acceptable if they are still fully connected with solder?

    3. Any technical names for both of the types of Soldering joints? Are they considered a type of BGA solder? (This would help us probe into more details for research)

  • 0 in reply to Lidong Yu
    TI__Expert 8130 points

    Hi Lidong,

    I do not see any photos attached. Please provide the images for review. In the meantime, I have reached out to the team internally for further input.

    Thanks,
    Alejandro

  • 0 in reply to iAlejandro
    TI__Intellectual 1756 points

    Here is the photo, please check.

  • 0 in reply to Lidong Yu
    TI__Expert 8130 points

    Hi Lidong,

    Thanks for sharing the images.

    1. That is part of the component pin.
    2. There should be no gap. The defected pin solder and gap is a result of a defective re-flow process. The device is not being placed correctly during re-flow. Make sure that the device is placed properly. Do not place any components below the Module. Leave component free on top of pads. It is not recommended to use any tools to sustain.
    3. It is not a BGA solder.

    Regards,
    Alejandro