Hello;
In a space project we attend to use theTPS73801-SEP. Heat generated by the chip can be dissipated by conducting either from the top (RθJC(top) = 31.1°C/W or ψJT = 1°C/W) or bottom of the package (RθJB = 5.1°C/W or ψJT =5°C/W). The big difference between RθJC(top) and ψJT prevents us from finishing the design. What do you suggest us to do? please know that we read the SPRA953C
I appreciate your help in advance
Dov Alon
