Because of the Thanksgiving holiday in the U.S., TI E2E design support forum responses may be delayed the week of Nov. 21. Thank you for your patience.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS73801-SEP: TPS73801-SEP

Part Number: TPS73801-SEP

Hello;

In a space project we attend to use theTPS73801-SEP. Heat generated by the chip can be dissipated by conducting either from the top (RθJC(top) = 31.1°C/W or ψJT = 1°C/W) or bottom of the package (RθJB = 5.1°C/W or ψJT =5°C/W). The big difference between RθJC(top) and ψJT prevents us from finishing the design. What do you suggest us to do? please know that we read the SPRA953C

I appreciate your help in advance

Dov Alon