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TLV62569: TLV62569 Oxidation and Poor Solder Coverage between Lead and IC Package

Miranda J
Intellectual 400 points
Part Number: TLV62569

Hi, customer did dip & look solderability testing due to observations on oxidation between lead and IC package.

Here is illustration of the oxidation picture, parts with fairly new DC 2122. This does not seem to the roughened lead frame: https://e2e.ti.com/support/logic-group/logic/f/logic-forum/718449/faq-why-do-the-leadframes-look-strongly-oxidized-or-corroded and please correct me if I am wrong. 

Here is the picture for after dip & look. The red circled areas showed poor solder paste coverage; which was also the areas identified for solderability. 

The concerns are how seriously this lack of solder coverage in the areas between leads and IC package; will affect the performance on the boards. 

Is it necessary to strip the tin coating of the leads and re-tin the lead surfaces in order to remove the oxidation and fully cover the leads?

Please kindly advise. 

Thanks,

Miranda

  • 0
    TI__Genius 10730 points

    Hi Miranda,

    In general, this un-soldered area should not be a problem as this is near to IC molding part which can push the soldering towards outer side of lead (If the leads are connected to board properly, everything should be fine). I will check with the concerned people to confirm this and I will let you know after that.

    Best Regards,

    Farheen

  • +1
    TI__Genius 10730 points

    Hi Miranda,

    Yes, you are right it does not have a roughened lead frame and about your second concern, the unsoldered area between IC package and leads should not cause any reliability issue. The areas highlighted by you do not have Sn plating and the CU surface is exposed and these highlighted areas are not plated because of the mold flash that can exist on the lead.

    Feel free to ask if you have further question.

    Thanks and Best Regards,

    Farheen

  • 0 in reply to Farheen
    Intellectual 400 points

    Hi Farheen, thanks for your time. I think I got the essentials of your explanations.

    In the meantime, I have a few more questions, which might be easier to elaborate in the email offline. Could you send me an email? It is a bit easier to explain with multiple pictures in the emails. 

    Let me know.

    Thanks,

    Miranda

  • 0 in reply to Miranda J
    TI__Genius 10730 points

    Hi Miranda,

    Yes sure you can send me an email. 

    Thanks and Best Regards,

    Farheen