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CSD19532Q5B: SON 5x6 FET package thermal properties

Mitchell
Expert 4915 points
Part Number: CSD19532Q5B

Hi Team,

My customer is looking at using the CSD19532Q5B FET. They like the smaller package size versus a D2PAK, but the datasheet is light on thermal information.

Do we have any additional data on the SON 5x6 FET package's thermal properties?

-Mitchell

  • +1
    TI__Mastermind 29525 points

    Hi Mitchell,

    Thanks for promoting TI FETs at your customer. We only spec RθJC (bottom) and RθJA in the datasheet. Please visit the MOSFET Support & training page at the link below. There you will find a blog on how we test and spec thermal impedance of our FETs. We have done some thermal simulations and testing. For this package and die size, the thermal impedance thru the top, RθJC (top) is is about 8°C/W. Please feel free to contact me via regular email if you have additional questions.

    Thanks,

    John Wallace

    TI FET Applications

    https://www.ti.com/power-management/mosfets/support-training.html