CSD25501F3: Package body material

Kazuki Itoh

Genius 10355 points

Part Number: CSD25501F3

Hi team,

Is the package body of CSD25501F3 molded resin or bare wafer?

My customer cares if the solder can contact to the package body.

Could you please provide the bottom package photo of CSD25501F3 to check it?

Best regards,

Itoh

over 3 years ago

0 John Wallace1 over 3 years ago

TI__Mastermind 36530 points

Hello Itoh-san,

Thanks for the inquiry. Our FemtoFETs have no plastic packaging and yes, the body of the device is silicon. As long as the customer follows TI recommendations in the datasheet, there should be no concern with solder contacting the body of the FET. Please visit the MOSFET Support & training page at the link below. There you will find the SMT guidelines for our FemtoFET devices. Please feel free to contact me via regular email if I can be of further assistance.

https://www.ti.com/power-management/mosfets/support-training.html

https://www.ti.com/lit/slra003

e2e.ti.com/.../turning-sand-into-gold

Best Regards,

John Wallace

TI FET Applications

Power management

Power management forum

CSD25501F3: Package body material