LMR33620AP-Q1: LMR33620AP-Q1 doesn't use Solder bump?

Kazuhisa Hara1

Part Number: LMR33620AP-Q1

Hi Team,

I saw the material declaration of LMR33620APCRNXRQ1 on ti.com.

The data shows no solder bump in LMR33620APCRNXRQ1.

Is that correct ?

If it is correct, Please let me know how do it connect between die and lead frame.

Thanks and Regards,

HARA

0 Arief Hernadi over 4 years ago

Hi Hara,

I don't see the information on the solder bump difference between the two. Internally there is copper pillar for the hot rod package

The difference between them is Assembly and Test site and the finish i believe. Attached is some information in regards of the difference

Thanks

-Arief

0 Kazuhisa Hara1 over 4 years ago in reply to Arief Hernadi

Dear Arief,

Thank you for your reply.

Could I send e-mail you directly ?

I would like to discuss about this more.

Thanks and Regards,

HARA

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