Hello All,
I would like to the the criterial of mold compound void or die attach void for TPS74801DRCT.
Is there any allowed size for the voids? I have marked the voids on the attached picture.
Is there any functional issue of the voids presence?
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Hello All,
I would like to the the criterial of mold compound void or die attach void for TPS74801DRCT.
Is there any allowed size for the voids? I have marked the voids on the attached picture.
Is there any functional issue of the voids presence?
Hello,
I have reached out to a Packaging Engineer about this query, please provide us 2 business days to get back to you. Thanks!
Regards,
Srikanth
Hello,
These are Die attach voids and are not anything to be concerned about. The only criterion on their size is that they should not exceed 50% of the Die attach region. Thanks!
Regards,
Srikanth