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TLV62569: TLV62569DBVR step down converter

Part Number: TLV62569


I am new to electronics so am hoping for some help in understanding some aspects of the TLV62569DBVR Buck Converter.  I am hoping to use the SOT-23 (DBV) package rather than the smaller options.  I have looked at the evaluation boards available from TI and can see they come in three types 789, 860 & 884.  I cant however work out the difference between those three boards other than the board layout and am hoping someone can help me understand where the differences occur.  

I am using Fusion360/Eagle for my design app and have installed a library of TI parts including the TLV62569DBVR.  However when I am inserting the part in to my schematic I am given three options as follows: 




Each of those options has the same set of package components but seem to vary in size for the footprint.  Can anyone advise what the designations mean.  (L) Large?, (M) Medium?? (N)???  As I will be sending the design to  PCB Manufacturer who I know has a stock of the TLV62569DBVR (one of only a few it seems) I will need to set my PCB Board design to suit the appropriate footprint and although the manufacturer may correct me if I choose the wrong one I would rather be in charge of my own designs.

Hope someone can advise

  • Hi Leslie,

    The difference between the three different EVMs is in the package of the IC on it.
    Type 789 has a 5-pin SOT-23 package compared to the other two types this one does not ha a Power Good (PG) pin.
    Type 860 has a 6-pin SOT-5X3(DRL) package.
    Type 884 has a 6-pin SOT-23 THIN (DDC) package.

    The difference between DBV0005A_N/M/L is just in the pad size on your PCB.
    This is really just a matter of the design, the functionality will stay the same so if you plan to change the devices on your PCB then bigger pads (DBV0005A_N) would be helpful besides that the smalls size should work fine.