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TLV733P-Q1: Layout Recommendation

Part Number: TLV733P-Q1

Hi team,

Our customer is designing layout for TLV73318PQDRVRQ1. They would like to know if GND pad/VIA are necessary and how to design them in specific. For example, what size/amount of GND pad/VIA should be used for power consumption above specific watt, or they are not needed for power consumption below specific watt

Is there any recommendation on GND pad/VIA design?

Thank you,

Muwei Zheng

  • Hi Muwei,

    We do not have any concrete layout rules for the part, section 9 of the datasheet has the first steps of layout rules. In terms of ground and thermal via's our recommendation is to maximize both. As you increase the ability for the LDO to dissipate the heat the better the performance. Additionally we have an app note talking about maximizing thermal performance linked below. As for via sizing, for thermal performance it is recommended to have the smallest via's possible, and as many as possible to allow the maximum copper to dissipate the heat. The recommendations we make are not concrete, and are generally on a case by case basis for the part the customer is using.

    Thermal app note 

    Let me know if you need a more specific look at their design, otherwise, I hope this helps.