Dear TI partner:
TPS81256SIPR is widely used in our company’s products. Normally, we do regularly QA check like SAT, this time we selected 1pcs sample from DC 2105 lot 1801931PT2,the through scan result shows that seems there is a delamination at the underfill to die’s nitride layer interface, delamination at the underfill to aluminum interface, and delamination at the underfill to RDL interface. Due to this is a uSiP package, we just can apply through scan after solder down the inductor and capacitor on the top side, and then polish to C1 layer as below picture showing, here we’d like ask help from TI expert to check whether this delamination finding is fake or notTPS81256SIPR Delamination Verification_20211105 (1).pptx
