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[FAQ] How can I optimize the thermal performance of high power density buck converters?

Yann Ducommun
Intellectual 2605 points
Other Parts Discussed in Thread: TPS62866

My high current application may be thermally limited and I'd like to understand how to optimize the thermal performance of the high power density buck converters - in particular, what needs to be considered in the PCB design to dissipate the heat efficiently through the PCB and enable low operating temperatures

  • 0
    TI__Intellectual 2605 points

    In a nutshell, layout is essential to optimize the thermal performance of a high-density buck converter. Thermal vias play a significant role in vertical heat dissipation and they must be placed directly below or very close to the heating elements/components. Additionally, the effective thermal resistance of parallel vias in an array is much less than that for a single via. Hence a number of vias can be closely spaced for better heat dissipation. If the component density is not too high on the PCB, through-hole micro vias would be sufficient to dissipate heat on the PCB. Blind vias are normally used in HDI PCBs where component density is too high and when multiple traces are present in the inner PCB layers which cannot be cut-through. Therefore, by using simple through-hole micro vias, a performance and cost optimized solution can be achieved.

    The following application note can be used as a more detailed design guide to implement high power density designs in thermally-limited applications:

    "Thermal Performance Optimization of High Power Density Buck Converters"

    It provides an insight into the thermal performance optimization of high-power density buck converters, taking the example of TPS62866, and focuses on the trade-offs between possible design enhancements and the costs incurred. Additionally, comparison between simulated and measured results is discussed.