TPS50601-SP: Is thermal pad strictly for heat dissipation or for current sinking as well?

Eric Paterson

Part Number: TPS50601-SP

Hi there,

The TPS50601-SP datasheet states that the the thermal pad and PGND need to be connected together on the PCB. The thermal pad and GND signal are connected in the IC package (continuity manually verified).

If the thermal pad is not connected to GND, is it sufficient to connect GND (pin 1) and PGND (pin 8-10) on the PCB? Or is the thermal pad required for current sinking?

The current design configuration has the package upside-down, with a heat sink on the thermal pad that is facing upward.

over 2 years ago

0 Sarah Koch over 2 years ago

TI__Expert 7045 points

Hi Eric,

I will ask the expert on this device to take a look at your question and provide guidance. Leaving the thermal pad unconnected to ground externally is acceptable for some of our other parts, but I am not sure whether or not that is also true for this device.

Thanks,

Sarah

0 Sarah Koch over 2 years ago

TI__Expert 7045 points

Hi Eric,

Thanks for your patience.

As you mentioned, the thermal pad is internally connected to GND. Because of this, it is sufficient to connect GND (pin 1) externally to PGND on the PCB and not use the thermal pad to make the electrical connection.

A few additional details can be found in the answer to this previous E2E post: https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/901009/tps50601-sp-thermal-isolation-pad-and-package-metal-lid

Hope this helps,

Sarah

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TPS50601-SP: Is thermal pad strictly for heat dissipation or for current sinking as well?