LM117: LM117

Michael Harmeyer

Part Number: LM117
Other Parts Discussed in Thread: TPS7A4501-SP

We’re doing a DPA on the parts listed below. Per MIL-STD-883, TM 2018, SEM is not required for planar die. Is the die fully planar with no oxide steps? Are chemical mechanical polish (CMP) processes used? Or is SEM required?

5962-1222402VHA (TPS7A4501-SP)

5962R9951707VZA (LM117GWRLQMLV)

Thanks,

over 3 years ago

0 Nick Butts over 3 years ago

TI__Mastermind 48665 points

Hi Michael,

I apologize for the delay. I have reached out to try and find this information for you.

Because of the upcoming holiday the response may be delayed. Please allow 3-4 business days.

Thanks,

Nick

0 Prakash Lakhit over 3 years ago

TI__Expert 5136 points

Michael,

Both these devices do not have CMP and no oxide steps in the back end. So, they should be fully planar die.

Thanks,

Prakash L

0 Michael Harmeyer over 3 years ago in reply to Prakash Lakhit

Prodigy 230 points

I just noticed that back in 2018 Alex Segler confirmed for us the 5962R1222403VXC (TPS7A4501RHAKGD) was non-planar and required SEM. Isn't the 5962R1222403VXC similar to the 5962-1222402VHA (TPS7A4501-SP)? Wouldn't they both be planar or non-planar?

0 Prakash Lakhit over 3 years ago in reply to Michael Harmeyer

TI__Expert 5136 points

Michael,

The back end does not have any oxide or CMP. However, I do see oxide deposition post and pre implant. I am guessing that's considered non-planar based on that, apologize for the confusion. Hope that confirms that both 5962R1222403VXC (TPS7A4501RHAKGD) and 5962-1222402VHA (TPS7A4501-SP) are similar. I did confirm that the other device 5962R9951707VZA (LM117GWRLQMLV) does not have any oxide layers.

Thanks,

Prakash L

Power management

Power management forum

LM117: LM117