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Soldering question on CSD15380F3 MOSFET

Pat Szymko
Prodigy 10 points

Hello,

What is the best stencil pattern for this device?  I followed the guidelines on the data sheet .2mm x.25mm for the small pads but saw a lot of solder balls around the device after reflow soldering.  Would .15mm x.25mm be better and reduce solder balls?    Thanks

  • 0
    TI__Mastermind 36140 points

    Hello Pat,

    Thanks for your interest in TI FETs. Following the guidelines in the datasheet should yield good soldering results. Below is a link to the SMT guidelines for TI FemtoFET devices. Are you using SMD or non-SMD pads, what solder paste are you using and can you share your reflow profile? I am going to ask our SMT expert to weigh in on this question. He may have additional questions.

    https://www.ti.com/lit/slra003

    Best Regards,

    John Wallace

    TI FET Applications

  • 0 in reply to John Wallace1
    TI__Mastermind 36140 points

    Hi Pat,

    Below is the response from our SMT expert. Please review and let me know if you have any additional questions.

    The recommended stencil was slightly larger than the PCB pad. The main reason was to meet area aspect ratio so that the solder
    paste can be printed. Can the customer provide a worse case X-ray to see how bad the solder balling was? For solder paste, need to understand manufacturer P/N and flux contents (%). Check to make sure it has not expired. If the solder paste had been warmed up to room temperature before use. Floor life: How long has the solder paste been open and how long the solder paste was printed on the PCB before component mounting and reflow. The longer the solder paste is exposed to air, the more moisture it would absorb and cause solder balling.  

    Thanks,

    John