Hi all,
I received some concern from my customer regarding the TLV717P x2son footprint.
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There appears to be a mismatch between the footprint shown in the datasheet and the downloadable UltraLibrian foot print provided on the product page. At least this appears to be the case for Altium Designer.
- https://www.ti.com/product/TLV717P#cad-cae-symbols
- https://vendor.ultralibrarian.com/TI/embedded/?gpn=TLV717P&package=DQN&pin=4&sid=017d775850e8000d8a1536becdbe0004e002200d00bd0&c=1
1.) The thermal pad solder mask differs between the datasheet and Ultralibrian footprint. The datasheet shows a solder mask defined pad (solder mask opening is smaller than the copper). While in the ultralibrarin footprint, the solder mask is the same size as the copper.
2.) The solder mask on each of the 4-pins is oddly different; larger than the datasheet and oddly shaped. My thinking is that the altium pad is being imported too large. Changing pads to a smaller size shows the "manually drawn" copper pads. The solder mask for the manually drawn copper pads match the datasheet. This is NOT the case for the thermal pad, as mentioned in #1.
I have tried to verify the footprint by locating a reference design, but I have not succeeded. The posted reference design on the TLV717P product page does not appear to have a TLB717P in it.
After manually resizing the "altium pads'' to be smaller than the manually drawn copper. (See below)
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Thanks,
Lauren
