LP2950-N: Altitude

Hi Ray,

We do not have any test data at altitude demonstrating the parts will survive, however we can use the pin spacing and IPC-2221 to help assess this.  As a refresh, the lower the voltage is in the customer application, the less opportunity for an arcing event and damaged hardware.  The LP2950-N has the following minimum pin spacing:

WSON package: 0.45mm
TO-252 package: 1.405mm
SOIC package: 0.76mm
DIP package: 0.76mm

The best case scenario would be for the customer to use the TO-252 package, followed by either the SOIC or DIP package, and least preferred would be the WSON package.  From the IPC-2221 table 6-1:

You are probably looking at column A6.  The IPC standard is limited to 10,000 feet and you will want margin above these numbers for an assessment at 30k feet.  At abs max ratings of the device and for an uncoated PCB, my opinion is the WSON may carry some risk while the SOIC / DIP is less risky, and the TO-252 is probably low risk.  However the customer will have to do their own assessment of this device to confirm that the device meets their needs at this altitude. 

Thanks,

Stephen