TLV755P: Can LP5912-3.3DRVR drop in if thermal pad is grounded?

Steve Widener

Part Number: TLV755P
Other Parts Discussed in Thread: LP5912, TLV755

Can the LP5912-3.3DRVR be placed on the TLV75533PDRV footprint - it looks like the GND pin 3 is different but the thermal pads would be grounded.

Noted that the LP5912 output cap is 1uF min vs 0.47uF min for the TLV755P

over 2 years ago

0 Kyle Van Renterghem over 2 years ago

TI__Genius 13085 points

Hi Steve,

These two devices use the same package (DRV) and if you look at the mechanical drawings at the end of the datasheet you can see that the measurements are all the same. The diagrams shown in the pin-out section of the datasheet are just for reference and are not to scale.

So yes, as long as their design has pins 3 and 5 grounded they could use either device (assuming they select Cout accordingly).

0 Steve Widener over 2 years ago in reply to Kyle Van Renterghem

TI__Genius 9575 points

Thanks Kyle - what is pin 3 isn;t grounded? Is it ok to ground only through the thermal pad?

+1 Kyle Van Renterghem over 2 years ago in reply to Steve Widener

TI__Genius 13085 points

Hey Steve,

All LDO GND pins must be grounded unless the datasheet explicitly states that a GND pin can be left open. The thermal pad is connected to the backside of the die and results in a resistive connection to the actual electrical ground node for the IC circuitry which is why it cannot be used as the GND connection unless the datasheet says otherwise.

So for LP5912, pin 3 can be left floating but pin 5 must be connected to GND. For TLV755 pin 3 must be grounded and pin 5 could be left floating.

0 Steve Widener over 2 years ago in reply to Kyle Van Renterghem

TI__Genius 9575 points

Thanks Kyle - Jus trying to find a substitute due to component availability.

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TLV755P: Can LP5912-3.3DRVR drop in if thermal pad is grounded?