Other Parts Discussed in Thread: TPS7A94
I want to evaluate the thermal performance of TPS7A92. Here I have some questions about the thermal metric for TPS7A92
- Why RθJB >> RθJC(bot)? to my understanding, the difference between this two is the resistance of solder, but why solder can influence such much?
- If we want to evaluate TJ before board come back, which parameter should we use for evaluating?
- I also look into TPS7A94, and find out the Recommended Junction temp is up to 150C which is the same with absolute maximum Junction temp. Does this device designed for 150C use or this is a typo for 150C recommended junction temp?