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CSD25402Q3A: Different Wire bonding Pattern

Miranda J
Intellectual 400 points
Part Number: CSD25402Q3A

Hi, there is a question from the customer side regarding the way that wire bonding laid out.

Both components are exactly same part numbers and date code have couple weeks differences. The number of wire bonds are the same.

Here are some more details:

The first pattern is from DC 2123, where wire bonding laid out with long-short-long-short.

The second pattern is from DC 2135, where wire bonding routed the other way: short-long-short-long

This is the first time that saw such variation; customer is curious about if different ways of wire bonding will affect any functionality and/or power consumption/circuitry of the components.  

Please kindly help advise. Thanks for your time upfront.

Regards,

Miranda

  • 0
    TI__Mastermind 38470 points

    Hello Miranda,

    Thanks for your interest in TI FETs. We have reviewed this information and fundamentally, there should be no performance difference since there are the same number of long and short wire bonds in each device. The wire bonds mainly contribute to the on resistance of the FET and any slight differences would be swamped out by the on resistance of the actual silicon.

    Best Regards,

    John Wallace

    TI FET Applications

  • 0 in reply to John Wallace1
    Intellectual 400 points

    Thank you John. Appreciate your info and will pass it along. If there is further concern, I will reach out to you. 

    Happy new year.

    Regards,

    Miranda