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CSD85301Q2: Thermal Resistances

Part Number: CSD85301Q2
Other Parts Discussed in Thread: CSD17318Q2

Hello, would the team be able to provide junction to case/board (C/W) thermal resistances for this device,


  • Hello Jesus,

    Thanks for your interest in TI FETs. Unfortunately, TI does not test or spec RθJC for the CSD85301Q2. For a single FET, CSD17318Q2, in 2x2mm SON, RJC = 7.9°C/W on 1in. x 1in., 2 oz. copper pad. This device has one large thermal pad and I would estimate RθJC ~ 10-12°C/W for the dual FET with two smaller thermal pads for each drain on the same 1in. x 1in., 2oz. copper pad.

    Best Regards,

    John Wallace

    TI FET Applications