TPS8268180: PbSn balls instead of SAC solder bumps possible.

Nicholas Verrecchio

Part Number: TPS8268180
Other Parts Discussed in Thread: TPSM82821

My team and I have been considering using this part (TPS8268180SIPT) in a future effort but cannot use the SAC solder bumps that are used. We were wondering if Texas Instruments possibly offer this part with PbSn balls instead? Otherwise we would have to refinish the part on our own and figured it would be easier to ask if its something they offer.

over 3 years ago

0 Excel Regidor over 3 years ago

TI__Mastermind 38241 points

Hello Nicholas,

We are glad for your interest in our products.

I will check if we can support your request for PbSn balls and come back to you immediately. By the way, what is the concern with SAC solder bumps?

Best regards,

Excel

0 Excel Regidor over 3 years ago in reply to Excel Regidor

TI__Mastermind 38241 points

Hi Nicholas,

We cannot change the solder ball from SAC to PbSn, because Pb is not used anymore in our assembly line. A possible option is to use TPSM82821 (A), which has ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) finish. However, the inductor placed at the Top layer still uses SAC.

I hope I was able to address your queries.

Best regards,

Excel

0 Excel Regidor over 3 years ago in reply to Excel Regidor

TI__Mastermind 38241 points

Hi Nicholas,

Just a soft reminder.

Do you have further questions? If not, can you kindly click the "Resolved" button below.

Thank you.

Best regards,

Excel

0 Excel Regidor over 3 years ago in reply to Excel Regidor

TI__Mastermind 38241 points

Hi Nicholas,

It looks like you don't have further queries. Hence, I'm closing this thread.

Thank you.

Best regards,

Excel

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TPS8268180: PbSn balls instead of SAC solder bumps possible.