We’re doing a DPA on a 5962R0722962VZA (LM117HVGWRLQMLV). Per MIL-STD-883, TM 2018, SEM is not required for planar die. Is the die fully planar with no oxide steps? Are chemical mechanical polish (CMP) processes used? Or is SEM required?
We’re doing a DPA on a 5962R0722962VZA (LM117HVGWRLQMLV). Per MIL-STD-883, TM 2018, SEM is not required for planar die. Is the die fully planar with no oxide steps? Are chemical mechanical polish (CMP) processes used? Or is SEM required?
