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Part Number: LM117HVQML

We’re doing a DPA on a 5962R0722962VZA (LM117HVGWRLQMLV).  Per MIL-STD-883, TM 2018, SEM is not required for planar die.  Is the die fully planar with no oxide steps?  Are chemical mechanical polish (CMP) processes used?  Or is SEM required?