CSD18531Q5A: Thermal Resistance, junction-to-case

Ken Schreiner

Part Number: CSD18531Q5A
Other Parts Discussed in Thread: CSD18533Q5A

Hello,

Could you confirm whether the junction-to-case thermal resistance (1 W/C) given for this part (CSD18531Q5A) is to the case top or bottom?

Also, do you have a junction-to-board thermal resistance for this part?

Thank you,

Ken

over 2 years ago

0 John Wallace1 over 2 years ago

TI__Mastermind 33855 points

Hi Ken,

Thanks for your interest in TI FETs. TI specs Rθjc to the bottom of the package on the drain pad. We do not test junction to board thermal resistance but it should be very close to the Rθjc value since the thermal pad is soldered directly to the PCB. Please check the link below for more information on how TI specs and tests thermal impedance of our MOSFET products.

https://e2e.ti.com/blogs_/b/powerhouse/posts/understanding-mosfet-data-sheets-part-6-thermal-impedance

Best Regards,

John Wallace

TI FET Applications

0 Ken Schreiner over 2 years ago

Prodigy 10 points

Hi John,

Thank you for the prompt reply.

Would happen to have the junction to case top thermal resistance?

Ken

+1 John Wallace1 over 2 years ago in reply to Ken Schreiner

TI__Mastermind 33855 points

Hi Ken,

We have not tested Rθjc(top) for the CSD18531Q5A. We've done thermal simulations of similar devices such as the CSD18533Q5A and it came in at 18°C/W. The CSD18531Q5A is lower on resistance and so it is a larger die which should improve the thermal resistance. I'd estimate it's about 15°C/W.

Best Regards,

John

Power management

Power management forum

CSD18531Q5A: Thermal Resistance, junction-to-case