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TLV767-Q1: TLV767-Q1

Part Number: TLV767-Q1

Hi,

Can you please tell what is the copper area for which the value of thermal resistance (junction to ambient) is 51.9 degC/W 

Regards,

Ajay

  • Hi Ajay,

    The board layout used is the JEDEC High-K board, defined in JESD51-7. This is a 4-layer board, on which there is no copper pour on the top layer except underneath the thermal pad (if present), on the top layer there are traces ran from the pins to the edge of the board, both internal layers are copper pours, and on the bottom layer there is a smaller copper island under the part. The board dimensions are 76.2mm x 114.3mm, and the copper island on the bottom layer is 74.2 x 74.2 mm with material properties representing 20% coverage. 

    I hope this helps.

    Regards,

    Nick