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Original question:

TPS7A4501-SP: Thermal pad connection

TPS7A4501-SP: Thermal Via Connection & Considerations

Josh C
Prodigy 10 points
Part Number: TPS7A4501-SP

Hello,

Are the GND and Thermal Via connections shorted (or resistively connected) internally to package? If not, can they be tied independently to local "digital ground" and "chassis ground" respectively?

 I don't have any information of the predicted potential difference (if there is any) between chassis and signal ground. Is this configuration not recommended?

Thank you,

-Josh

  • +1
    TI__Guru 62930 points

    Hello Josh,

    I can provide some details to help.

    Since you are talking about the thermal vias, my assumption is that you are using either the EM, or the RHA version in the HKR package.   The U package does not have thermal pad nor vias.

    There is a direct electrical connection between the lid, and the thermal pad for the HKR package.  This is not related to your question, but relevant.

    There is not a direct electrical connection between device ground pin, and the thermal pad/die substrate.

    However, there is a parasitic connection from the substrate of the die to the ground on the die.   The resistance between device ground and thermal pad can be somewhat variable based on processing variations.

    Thus, it is necessary that the thermal pad be at ground potential.  Any potential other than ground could have detrimental affects to device performance or reliability. 

    If this answers your question, please click "This Resolved My Issue"
    Regards,
    Wade

  • 0 in reply to Wade Vonbergen
    Prodigy 10 points

    Hello Wade,

    Thank you for the detailed response. Your response has indeed answered my inquiry.