Because of the Thanksgiving holiday in the U.S., TI E2E™ design support forum responses may be delayed from November 25 through December 2. Thank you for your patience.

  • State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 65 subscribers
  • Views 211 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TPS54332: PowerPAD

Gerald
Genius 9580 points
Part Number: TPS54332
Other Parts Discussed in Thread: TPS54232

Hi Experts,

Our customer is looking at TPS54232 and it mentions that a pin to pin alternative is TPS54332.
After he compares the two chips, he said they're not entirelly compatible.

It is however written in the datasheet of TPS54332 that the extra power pad must be connected to the GND. Unfortunatelly he is not allowed to make any design changes or new PCB releases.

Since it is quite often that the power pad only helps with the power dissipation, he wanted to check what will be the effect if the extra power pad is left NC.
Please let us know the effect or if its ok not to connect the powerPAD. Thank you.

Kind regards,
Gerald

  • 0
    TI__Expert 7430 points

    Hi Gerald

    The Power pad is used for heat dissipation which is associated with the thermal performance. Since the Rdson of these two parts are the same, so under the same set up, the thermal performance are similar to each other. If the thermal performance of TPS54232 can meet the requirement, there is no problem for the thermal performance of TPS54332 if thermal pad being left NC.

    BR

    Ruby