LM76003: Difference Between Usage Temp. and Test Temp. in reliability Report

Aditya Singh

Part Number: LM76003

Hi Team,

I am preparing a reliability report for the project and we are using multiple TI devices into the same. I am downloading the reliability data from below link-

www.ti.com/.../estimator.tsp

There are two temperatures provided into the report-

Usage temp- 55C
Test temp- 125C

Please let us know what is difference between both of them.

Also, if FIT is 0.2 which means 0.2 failures per 1E9 device-hours. Is below statement also true?

0.0002 failures per 1E6 device-hours

Regards,

Aditya Kumar Singh

over 2 years ago

0 Harrison Overturf over 2 years ago

TI__Genius 10655 points

Hello Aditya,

Let me contact our reliability engineer and get back to you with more information on this. Please expect a reply in 1-2 days.

Regards,

Harrison

0 Allan Webber over 2 years ago

TI__Intellectual 1380 points

Usage temperature would be the temperature that you use in your system. Test temp is the temperatures TI tested during HTOL. The calculation derates HTOL data to customer use.

FIT of 0.2 would be 0.2 failures in 1E9 hours.

For assessing FITs in an application to get a system level FIT, you may want to refer to this. https://www.ti.com/lit/an/spraby3/spraby3.pdf?

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LM76003: Difference Between Usage Temp. and Test Temp. in reliability Report