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LM76003: Difference Between Usage Temp. and Test Temp. in reliability Report

Part Number: LM76003

Hi Team,

I am preparing a reliability report for the project and we are using multiple TI devices into the same. I am downloading the reliability data from below link-

There are two temperatures provided into the report-

  • Usage temp- 55C
  • Test temp- 125C

Please let us know what is difference between both of them.

 Also, if FIT is 0.2 which means 0.2 failures per 1E9 device-hours. Is below statement also true?

  • 0.0002 failures per 1E6 device-hours


Aditya Kumar Singh