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UCC27322: PowerPAD connections

Part Number: UCC27322

Hey team, can you help with the below?

I'm using a TI UCC27322 MOSFET driver with a PowerPad. I understand the PowerPad is electrically connected to the substrate. My question is; must the PowerPad be electrically grounded to circuit ground or can it be left unconnected. IC power dissipation is not an issue for my application.

Thank you!

  • Hi Alex,

    Thank you for reaching out!

    It is recommended that the PowerPad be soldered to the copper on the PCB directly underneath the device package. The PowerPAD package is not designed to be used without the exposed pad being soldered to the PCB. 

    With that being said, leaving the PowerPad unconnected should not cause issues to the devices functionality. You may leave the PowerPad floating at the expense of the thermal dissipation that using the PowerPad provides.  

    For more info on TI PowerPad packages see this: https://www.ti.com/lit/an/slma002h/slma002h.pdf?ts=1649367445134

    Thank you,

    Kevin

  • Thank you, Kevin! One follow up - Is it possible to know why the power pad needs to be soldered even though the customer doesnt require an enhanced thermal path? Is it to just seal the die from external environmental effects, i.e. moisture or some contamination.

  • Hi Alex,

    Glad that I can help!

    Even though it is not recommended, it can be left floating (not connected) and still function if the device is not exceeding its junction operating temperature. Because the PowerPad is not being used as intended, the devices thermal performance will be compromised.

    The PowerPad is connected the ground substrate of the device. Leaving it unconnected could potentially cause the driver to pick up unwanted noise which could cause issues during operation.

    Although this is not recommended, if the customer leaves the PowerPad floating device should work fine.

    If you have further concerns please let me know!

    Thank you,

    Kevin