Other Parts Discussed in Thread: LM5069, CSD19532Q5B
Hi team,
I'm design TPS16630 as hot swap IC in the 56Vin/5A(max) system. The schematic show below.
The issue I have right now is the TPS16630 will damaged during the hot plug-in testing. (Hot plug-in: The external adapter was turn on the AC first, then I plug the DC connector to the system)
I had add an RC snubber R1382 and C1325 to reduce the voltage spike during the hot plug-in. I also do circuit simulation and experiment to optimize the RC snubber values. Then, the current value we are using is 2R7 + 1uF/0805 MLCC. But, the eFuse still have chance damaged during the hot plug-in testing.
Q1: Since, there without integrated MOSFET SOA chart in the datasheet, How to check the MOSFET operating safety under all conditions? (For example input hot plug-in, OCP, SCP, output short start-up etc.)
Q2: The damage is caused by voltage spike or inrush current during the hot plug-in? What can I do to analyze it?
Q3: How to increase the design margin of this application?
Thank you very much.
Muhsiu.