Our team have some queries here in regard our finding upon do CSAM to this ICs. During x-ray, we observed some voids inside this ICs.
After using 100x scope and focusing to this void area, we found that these voids are actually the bonding material gap in between the die and substrate.
We appreciate some expertise advise here on below queries :
1) Is this bonding material gap is common in ICs manufacturing?
2) What are possible risks arise when using this kind of ICs condition?