Data sheet www.ti.com/.../tps7a7002.pdf lists thermal resistance Junction to board as 29.9 C/W, and J to C (bottom) as 6.9 C/W. I am using the 29.9 C/W value in my 2-resistor model for thermal simulation. Is this value correct? Seems high compared to R to C (bot) for a component that looks designed to dump heat to the PCB.
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