Hi Team,
Please help here in providing the thermal breakout details for components available in the TPSM831D31MOA module at full load condition.
Thanks & Regards,
Prasad Tatar
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Hi Team,
Please help here in providing the thermal breakout details for components available in the TPSM831D31MOA module at full load condition.
Thanks & Regards,
Prasad Tatar
Hi Prasad,
As TPSM831D31 is a module, the datasheet has the thermal information as a single device instead of breaking out the losses between components.
Figure 6-7 and 6-8 in the TPSM831D31 datasheet, shown below for reference, gives insight on the maximum load that can be applied without shutting down at different ambient temperatures with different air flow at 400KHz.
Hi Murli,
Thanks for the reply.
We are doing the thermal simulation for our board and we required breakout for TPSM831D31MOA PCB Module components like CH-A regulator, CH-B Regulator, Inductor etc. power Dissipation data at full load.
for the reference we have attached the picture and mentioned the numbering on the IC. Please share the data for the same.
Thanks & Regards,
Prasad Tatar
Hi Prasad,
To get the approximate individual losses for #1,#2 and #5, you can divide the total losses given in the figure 6-3 below by 3 (for example, if VOUT=0.85V, power losses per device is approximately 12W/3=4W) . Losses given in figure 6-4 below can be used to estimate the power losses for #6.
Please note that these are the power losses when operated at 400KHz switching frequency at 12V input. These losses change with switching frequency.
Below are the approximate power losses of the remaining devices:
Power loss in #3 : 66mW.
Power loss in #4: 35mW.
Power loss in #7 <10mW.
Power loss in #9: 20mW.
Power loss in #8 <10mW