Hi Team,
Requesting for our customer. Do we have information on the junction-to-board and junction-to-case thermal resistance for LM2991QML, particularly for the CFP (NAC) package variant?
Thanks in advance!
Kind Regards,
Jejomar
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Hi Team,
Requesting for our customer. Do we have information on the junction-to-board and junction-to-case thermal resistance for LM2991QML, particularly for the CFP (NAC) package variant?
Thanks in advance!
Kind Regards,
Jejomar
Hi Jejomar,
I apologize for the delayed response.
The junction to case information is listed on the DS:
Furthermore, there is a document in our Product Folder that displays some of this information:
I will have to dig deeper to find out if there is any Junction-to-Board information.
Best,
Edgar Acosta
Hello Edgar,
Many thanks for your help about the junction to case information. Can we ask for an update if you're able to find any information about its Junction-to-Board thermal resistance?
Kind Regards,
Jejomar
Hi Jejomar,
I submitted a request to obtain Thermal simulations for this device using JEDEC standards, however, this does require some time and it could be up to 2 weeks depending on the workload. I will update you once this information is provided.
Best,
Edgar Acosta
Hello Edgar,
Noted on the timeline. Many thanks for your support!
Kind Regards,
Jejomar
Hi Jejomar,
I spoke too soon. I just checked the status for the Thermal request and here are the results:
Best,
Edgar Acosta