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BQ25792: Overheating

Part Number: BQ25792

Related thread:

https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/991267/bq25792-thermal-issues?tisearch=e2e-sitesearch&keymatch=BQ25792%2525252520temperature#

This device has no thermal pad underneath. How is it expected to dissipate heat? Which package pins are used for heat sinking?

We have tied ACDRV1 & ACDRV2 to ground, Vsysmin set to 2.5V and still getting up to 100deg with 2A charging.

Layout is in line with EVM, maybe slightly less continuous copper plane on the top layer to which the device is mounted. Is this critical?

  • HI Kiran,

    This new QFN package is supposed to heat sink through the IC pins, specifically the power pins like VBUS, PMID, SWx, GND, SYS and BAT.  So, connecting more copper to those on, preferably on top and bottom, but also internal layers is necessary for optimal heat sinking.

    Regards,

    Jeff