This device has no thermal pad underneath. How is it expected to dissipate heat? Which package pins are used for heat sinking?
We have tied ACDRV1 & ACDRV2 to ground, Vsysmin set to 2.5V and still getting up to 100deg with 2A charging.
Layout is in line with EVM, maybe slightly less continuous copper plane on the top layer to which the device is mounted. Is this critical?