Other Parts Discussed in Thread: TPS548D22
Hi,
We met a question about below:
1. C-SCAN(Die surface): To inspect for the existence of defect, voids is visible for tested sample.
2. C-SCAN(Leadframe): To inspect for the existence of defect, no defect is visible for tested sample.
3. B-SCAN(Die surface): To inspect for the existence of defect, voids is visible for tested sample
Will this affect normal use?
Looking forward your reply
Thank you