We are looking for thermal resistance - Rjb of CSD16323Q3, but cannot find it in device datasheet.
Could you share Rjb data with us? thanks.
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Thanks for the inquiry. The junction-to-case thermal resistance, Rθjc, specified in the datasheet is to the thermal pad on the bottom of the package effectively making it Rjb. For more information on how TI tests and specs thermal impedance of our FETs, please check the link below.
TI FET Applications