TPS7H1210-SEP: Coefficient of linear expansion, Young's modulus, Poisson's ratio, and density Request

Yutaro,

Let me research this with our packaging team to gather this information, and reply back.   I will let you know status Monday at the latest.

Regards,

Wade

Hi Wade

Could you please answer each value of the plastic package?

Thanks,

yutaro

Yutaro,

I have CTE data available for the package components.   The rest of the data is going to take longer to obtain. 

Note, that we do not have an aggragate CTE value, but CTE by package component.
Material          CTE (ppm/°C)
Leadframe            14-17
Mold Compound     9<130°C, 36>130°C
Mount Compound   30<120°C, 85>110°C
Silicon Die         2.61

I will send you an email and coordinate getting you the remaining packaging parameters.  Our packaging team is working on this now.

Regards,

Wade

Yutaro,

Our packaging team is still working on collecting additional data that you request.   

Can you provide a summary of how you will be using this data?

Thanks,

Wade

Hi Wade

Thank you for the survey.

The purpose of using the obtained data is for the purpose of investigation when adopting it for artificial satellites.

Thanks,

Yutaro

Thank you Yutaro.

I will be out of the office, but I have informed a co-worker that can update the information when it becomes available.

Presumably you are using this information for modelling of packaging for reliability purposes?

Regards,

Wade

Hi Wade

Thank you for the survey.

I have heard that physical property information is necessary for conducting heat simulations.

Thanks,

Yutaro

Hi Yutaro,

I am covering for Wade while he is out of office. Thank you for confirming the reason this information was requested.

We are still working with our packaging team to obtain the data and will update you when it is available.

Thanks,

Sarah