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Original question:

TPS4H160-Q1: why demagnetized is larger than stored energy during the on time

TPS1HC100-Q1: questions about functional safety doc

Elec Cheng
Expert 7055 points
Part Number: TPS1HC100-Q1

Hi Expert,

Our customer read "TPS1HC100-Q1 Functional Safety" and they have some question.

Question 1:

What's the relationship between (FIT) Rates and Failure Mode Distribution (FMD) and Pin Failure Mode Analysis (Pin FMA). Are are correlated?

In (FIT) Rates part, there are two kinds, Die FIT and package FIT. But later in Failure Mode Distribution (FMD) part and Pin Failure Mode Analysis (Pin FMA) , the customer think FMD is related with Die FIT rate and Pin FMA is related with package FIT. But here is one question, if so, package FIT should contains more besides Pin. 

May you help explain their relations? Thanks.

Question 2:

In particular, do we have failure mode of short-circuit to ground and the corresponding failure rate information regarding Vbb pin? 

BR,

Elec Cheng

  • 0
    TI__Genius 16390 points

    Hi Elec,

    For question 1:

    Both FMD and FMA should be referring to the total failure rate - either cause by die failure or package failure. For example, for FMA, if a pin is shorted to GND, it can cause damage to the package, to the die, or both.

    For question 2:

    Is the question the failure mode when VBB pin is shorted to GND? When VBB is shorted to GND, the part will see 0V at the input and will not function, but it will not cause a damage to the device. It's in Failure Effect Class B, which means no damage to the device, but will lose functionality due to UVLO.

    Regards,

    Yichi