Other Parts Discussed in Thread: LM5069EVM-627,
in Application Note SLPA015 in section 3.4 is example of temperature calculation for power dissipation design with thermal vias. Thermal via has significant thermal resistance. In the example rise temperature calculated from thermal resistance of vias is simple added to rise temperature form planes and ambient temperature to estimate IC temperature.
It seams like vias only increase thermal resistance of design, instead decrease it and is possible to make a conclusion that thermal vias only worsen the result of thermal resistance of design !? I suppose that, this method of calculation could be wrong.
Could you explain this issue for me?
PS. SLPA015 is very useful and practical guide for designer. Thanks TI.