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LM5010A-Q1: Exposed Pad connection

Harry Bach
Prodigy 10 points
Part Number: LM5010A-Q1

The datasheet does not state how the exposed pad (underside) is electrically connected. Is it possible to connect this pad to GND (same as DAP, SGND, RTN)?

  • 0
    TI__Genius 10655 points

    Hello,

    Please see below from the Layout Guidelines section:

    The exposed pad on the IC package bottom should be soldered to a ground plane, and that plane should both extend from beneath the IC, and be connected to exposed ground plane on the board’s other side using as many vias as possible. The exposed pad is internally connected to the IC substrate. The use of wide PC board traces at the pins, where possible, can help conduct heat away from the IC. The four no connect pins on the HTSSOP package are not electrically connected to any part of the IC, and may be connected to ground plane to help dissipate heat from the package.

    Regards,

    Harrison Overturf